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Qianli 4in1 Interposer Middle Frame Layer BGA Reballing Stencil Kit for IPhone 14 Pro Max Soldering Tin Balls Heat Kit
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Penghantaran

Penghantaran Dari
Mainland China
Anggaran Penghantaran
Nov 22, 2024 - Dec 13, 2024

Warna

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Kuantiti

94 Unit lagi
Jumlah
RM 131.24
Gambaran Kedai
Dongfang Home Furnishings
9 hours ago
Produk 41025
Pengikut 13
Penilaian 4.3
Sertai 6 Months Ago
Kadar Pembatalan 0%
Spesifikasi Produk
Category
: Home & Lifestyle  >  Outdoor & Gardens  >  Outdoor Power Tools
Brand
: NoBrand
Model
: Not Specified
SKU
: 2.22E+11
Dimension (Length x Width x Height)
: 10.00 x 15.00 x 20.00
Weight(kg)
: 1
Manufacturing Country
: Not Specified
Warranty Type
: No Warranty
Warranty Value
: -
Warranty Description
: -
Hantar Dari
: Mainland China

Deskripsi Produk
Qianli Toolsplus 4in1 Interposer Middle Frame Layer BGA Reballing Stencil Kit For iPhone 14 Pro Max Soldering Tin Balls Heat Kit


14 Series Reballing, here it comes4 in 1 Middle frame reballing platform


Precise positioning forthe motherboard in high precision


strong magnetic pressing with no bulge


Phone 1414Plus 14Pro14Pro Max





Sliding dislocation design





Strong magnetic adsorption


Fast and convenient


Precise positioning


Selected material








Applicable motherboard models


4 in 1 Suitable for Phone


Series 14 (4 models) motherboard


Applicable to iPhone 14/Plus/Pro/Pro Max


Middle frame reballing platform








To show the beauty of design


in a compact shape


Motherboard reballing without worry


compact and easy, saving space


Penilaian produk
- / 5.0
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