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RELIFE SP-50 Solder Paste BGA Tin Paste for Phone Circuit Board Motherboard IC Repair Tools 158 degree
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Penghantaran

   Penghantaran Percuma
Penghantaran percuma East Malaysia untuk pesanan melebihi RM 50.00
Penghantaran percuma West Malaysia untuk pesanan melebihi RM 50.00

Penghantaran Dari
Free Trade Zone
Anggaran Penghantaran
Jun 01, 2024 - Jun 15, 2024

Warna

Sila pilih variasi produk terlebih dahulu

Kuantiti

100 Unit lagi
Jumlah
RM 45.5
Gambaran Kedai
Munich
48 minutes ago
Produk 43924
Pengikut 61
Penilaian 4.5
Sertai Within a Year
Kadar Pembatalan 0%
Spesifikasi Produk
Category
: Automotive & Motorbike  >  Moto Parts & Accessories  >  Moto Parts & Spares  >  Ignition & Electrical
Brand
: NoBrand
Model
: Not Specified
SKU
: 8ZPNDFRZ
Dimension (Length x Width x Height)
: 10.00 x 15.00 x 20.00
Weight(kg)
: 0.6
Manufacturing Country
: Not Specified
Warranty Type
: No Warranty
Warranty Value
: -
Warranty Description
: -
Hantar Dari
: Free Trade Zone

Deskripsi Produk
158 degree , Customized for BGA IC welding
Soldering joint bright
Full Wuxi beats
Moderate viscosity
After welding less residue, appearance and transparency
High insulation resistance
Has good wettability, excellent welding


Product Specification
Model: SP-50
PARTICLE SIZE(UM): 20-38
CONDUCTIVITY(%fCu) : 14.0
FLUX CONTENT (WT%) : 9±0.5
VISCOCITY(25C Pa.s) : 178±10
Weight : 40g


Return & Exchange Policy
If you find a defect with any product purchased, please let us know within 3 days from the day that you received your item
We will pay the return shipping costs if the product is defective or the return is a result of our error.
If the item is returned for any other reason, you are responsible for the return shipping amount
Please note that the warranty/ exchange /refund process might take up to 2-5 working days to complete
Penilaian produk
- / 5.0
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